High-temperature pressure chamber

Import substitution: Breaking reliance on imports, semiconductor-grade chambers achieve fulli ndependent control.

Vacum insulation, ultimate energy efficiency: Patented vacuum insulation layer locks in high temperatures, reducing heat loss by 90% significantly.

External cooling, uniform and efficient: 90% of the chamber surface directly participates in heat exchange, completely avoiding temperature shock risks from internal cooling and eliminating hidden dangers of joint fatigue and leakage.

Automatic door opening, constant temperature self-control: Contactless opening, generating real-time thermal field cloud maps of the chamber.